An On-Chip ESD Sensor for Use in Advanced Packaging
نویسندگان
چکیده
Electrostatic discharge (ESD) failure results in about 35% of integrated circuit (IC) field return and causes several billion-dollar losses to the semiconductor industry per year. Most modern ICs include on-chip ESD protection circuitry which comes at cost I/O performance. Static charge accumulation during transport handling may exceed limits this cause damage ICs. Modern advanced packaging technologies are not amenable rework if one or more components compromised. An sensor is useful identifying preventing assembly compromised dielets any technology. Two approaches for that can be employed on die, following ground rules within technology presented. Both designed, simulated, fabricated, experimentally characterized using GlobalFoundries 22-nm fully depleted silicon-on-insulator (FDSOI) While determining voltage sensors, we encounter two events naturally random. First, a random event with some probability distribution function (PDF) respect voltage. In addition, oxide breakdown sensors also Weibull distribution. A Bayesian method developed estimation PDF sensors. Experimental testing an gun from number broke down The estimated closely matches dies were subjected experimental verification.
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ژورنال
عنوان ژورنال: IEEE Transactions on Components, Packaging and Manufacturing Technology
سال: 2022
ISSN: ['2156-3950', '2156-3985']
DOI: https://doi.org/10.1109/tcpmt.2022.3177663